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In the highly competitive semiconductor industry, TSMC and Samsung are going head-to-head in the advanced packaging market. This market involves stacking or arranging different chips to maximize performance, and it has become a focal point for these industry giants.
The advanced packaging market is rapidly expanding and is projected to grow from $443 billion in 2022 to $786 billion in 2028. Recognizing the significance of this market, the Biden administration has pledged $3 billion in subsidies to support the development of a domestic supply chain for advanced packaging in the United States.
TSMC, a leader in the advanced packaging market, has made a strategic decision to withdraw, prompting Samsung to step up and solidify its position. Intel, another major player in the semiconductor industry, is also actively participating in this market.
The advanced packaging market plays a critical role in driving technological advancements throughout the semiconductor industry. Companies are focused on maximizing chip performance, particularly in emerging fields such as artificial intelligence and high-performance computing.
As the advanced packaging market continues to evolve, TSMC, Samsung, and Intel are leveraging their expertise and resources to provide cutting-edge solutions that meet the increasing demand from various industries. This market’s exponential growth is expected to attract significant investments and create new job opportunities.
The withdrawal of TSMC and the response from Samsung have intensified the competition among major players in the advanced packaging market. This dynamic market requires continuous innovation and adaptability to meet the evolving demands of industries.
The Biden administration’s support for the development of a robust domestic supply chain underscores the strategic importance of advanced packaging. It is anticipated that the growth of this market will contribute to job creation, economic growth, and technological advancements in the semiconductor industry.
Source: Hankyung Economy
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